- Micrel / Microchip Technology
- 8.5 V
- ±5%
- Die
- -
- Die
- Bulk
- -65°C ~ 175°C
- Surface Mount
- 350 Ohms
| Pwodwi atribi |  |
|
|
|
|---|---|---|---|---|
| Nimewo Pati | CD4772A | CD4770A | CD4776A | CD4775 |
| Manifakti | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Enpedyans (Max) (Zzt) | - | - | - | - |
| Seri | - | * | * | * |
| Pake / Ka | - | - | - | - |
| Operating Tanperati | - | - | - | - |
| Founisè Aparèy pake | - | - | - | - |
| Pakèt | - | Bulk | Bulk | Bulk |
| Voltage - Zener (Nom) (Vz) | - | - | - | - |
| Mounting Kalite | - | - | - | - |
| Tolerans | - | - | - | - |
Nou entèdi kontwole bon jan kalite a nan pwodwi yo, anviwònman ak sèvis.Pa sètifikasyon an ISO nan twazyèm pati a.
Wè plisMetòd peman an ka chwazi nan metòd yo montre anba a: transfè fil (T/T, transfè labank), Western Union, kat kredi, PayPal.
Sòlvan-mwens, doub-geri penti konfòmèl soti nan Dow
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Èske w gen yon bon craic nan konsepsyon pwodwi inovasyon
Infineon ap eseye PCB resiklab pou Demo ak Eval ankadreman
GE Fanuc Mezzanine Kat pou aplikasyon DSP
